{"id":24537,"date":"2024-01-15T19:34:00","date_gmt":"2024-01-15T19:34:00","guid":{"rendered":"https:\/\/www.prnasia.com\/story\/archive\/4310605_AE10605_0"},"modified":"2024-01-15T19:34:00","modified_gmt":"2024-01-15T19:34:00","slug":"revasum-inc-and-asahi-diamond-america-inc-join-forces-to-revolutionize-silicon-carbide-wafer-grinding","status":"publish","type":"post","link":"https:\/\/transmediavictoria.net.au\/?p=24537","title":{"rendered":"Revasum Inc and Asahi Diamond America, Inc Join Forces to Revolutionize Silicon Carbide Wafer Grinding"},"content":{"rendered":"
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SAN LUIS OBISPO, Calif.<\/span>, Jan. 16, 2024<\/span> \/PRNewswire\/ — Revasum Inc, a global leader in semiconductor manufacturing equipment, and Asahi Diamond America<\/span>, Inc, a renowned provider of diamond and cubic boron nitride tools, are pleased to announce their strategic collaboration aimed at enhancing silicon carbide (SiC) wafer grinding.<\/p>\n

The collaboration centers around the utilization of Revasum’s industry-leading 7AF-HMG Silicon Carbide Grinder, a cutting-edge solution specifically designed for the unique challenges posed by 150mm and 200mm silicon carbide wafers. This collaboration brings together Revasum’s expertise in semiconductor grinding and Asahi Diamond America’s<\/span> cutting-edge abrasive technology, marking a significant step forward in silicon carbide wafer manufacturing.<\/p>\n

The 7AF-HMG is distinguished by its hard material optimized grind engine that quickly and precisely thins and planarizes 150mm and 200mm silicon carbide wafers. Its advanced features and precision make it a game changer in the industry, ensuring highly efficient and productive processing of bare substrates and device wafers at customer facilities.<\/p>\n

Scott Jewler<\/span>, CEO of Revasum Inc, expressed his enthusiasm stating, "Our work with Asahi Diamond America<\/span> is a testament to our commitment to innovation and excellence in semiconductor manufacturing. The 7AF-HMG Silicon Carbide Grinder is a groundbreaking solution that addresses the unique challenges of silicon carbide wafers, and this cooperation will propel the industry forward by improving efficiency and performance."<\/p>\n

Koichi "Ken" Kikuchi, President of Asahi Diamond America<\/span>, Inc, echoed this sentiment, saying, "Asahi Diamond America<\/span> is thrilled to collaborate with Revasum Inc to elevate silicon carbide wafer grinding to new heights. Our cutting-edge grind wheels combined with Revasum’s advanced tools will empower semiconductor manufacturers to achieve unprecedented precision and efficiency in silicon carbide wafer processing."<\/p>\n

For more information, please contact:<\/p>\n

Info@revasum.<\/a>com<\/a><\/p>\n

About Revasum Inc:<\/p>\n

Revasum Inc is a global leader in the design and manufacturing of advanced semiconductor processing equipment. With a focus on innovation and reliability, Revasum provides cutting-edge solutions for the production of silicon carbide wafers and other semiconductor materials.<\/p>\n

About Asahi Diamond America<\/span>, Inc:<\/p>\n

Asahi Diamond America<\/span>, Inc is a leading provider of diamond and cubic boron nitride tools for a wide range of industries, including semiconductor manufacturing. With a commitment to quality and precision, Asahi Diamond America<\/span> delivers advanced tools that enhance the efficiency and performance of semiconductor processing.<\/p>\n

 <\/p>\n","protected":false},"excerpt":{"rendered":"

SAN LUIS OBISPO, Calif., Jan. 16, 2024 \/PRNewswire\/ — Revasum Inc, a global leader in semiconductor manufacturing equipment, and Asahi Diamond America, Inc, a renowned provider of diamond and cubic boron nitride tools, are pleased to announce their strategic collaboration aimed at enhancing silicon carbide (SiC) wafer grinding. 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