{"id":36305,"date":"2025-05-09T14:00:00","date_gmt":"2025-05-09T14:00:00","guid":{"rendered":"https:\/\/www.prnasia.com\/story\/archive\/4684145_HK84145_0"},"modified":"2025-05-09T14:00:00","modified_gmt":"2025-05-09T14:00:00","slug":"er-showcases-next-gen-laser-and-plasma-solutions-with-strategic-partners-at-semicon-sea-2025-in-singapore","status":"publish","type":"post","link":"https:\/\/transmediavictoria.net.au\/?p=36305","title":{"rendered":"E&R Showcases Next-Gen Laser and Plasma Solutions with Strategic Partners at SEMICON SEA 2025 in Singapore"},"content":{"rendered":"

KAOHSIUNG<\/span>, May 9, 2025<\/span><\/span> \/PRNewswire\/ — E&R Engineering Corp. is proud to announce its participation at SEMICON Southeast Asia 2025<\/b>, held at the Sands Expo & Convention Centre, Singapore<\/span><\/b> from May 20 to 22<\/span><\/b>. With over 30 years of dedication in the semiconductor industry, E&R will unveil its latest innovations in advanced laser and plasma processing, continuing to push the boundaries of semiconductor equipment technology.<\/p>\n

This year, E&R teams up with two strong partners \u2014 Zen Voce and GP Group \u2014 to form a powerful joint exhibition team. The three companies bring broad experience across different parts of the semiconductor industry, from front-end and packaging to back-end and automation. This collaboration shows our shared drive for innovation and quality, with the belief that “1 + 1 + 1 > 3” \u2014 where the combined strength of three creates more than each on its own.<\/p>\n

Featured Technologies from E&R:<\/b><\/p>\n

Plasma Dicing \u2013 Small Die Dicing Solution<\/b>
E&R delivers a hybrid laser grooving and plasma dicing solution that supports ultra-fine dice lanes (10\u201330 \u03bcm). Beyond equipment, E&R also provides a turnkey dicing service<\/b>, handling unique shapes like hexagons, circles, or MPR layouts with precision and consistency.<\/p>\n

FOPLP \u2013 Fan-Out Panel Level Packaging (700 \u00d7 700 mm)<\/b>
E&R’s total solution supports large panel processes including laser marking, laser cutting, laser descum, plasma cleaning, and post-drill de-smear, with a remarkable warpage control up to 16 mm. The process is further enhanced with laser debonding and plasma dry etching solutions for separation of glass carrier and panel.<\/p>\n

Glass Substrate Solutions<\/b>
E&R leads in glass core process equipment, offering:<\/p>\n