{"id":36359,"date":"2025-05-12T14:00:00","date_gmt":"2025-05-12T14:00:00","guid":{"rendered":"https:\/\/www.prnasia.com\/story\/archive\/4685165_HK85165_0"},"modified":"2025-05-12T14:00:00","modified_gmt":"2025-05-12T14:00:00","slug":"er-showcases-advanced-packaging-innovations-at-ieee-ectc-2025-in-texas","status":"publish","type":"post","link":"https:\/\/transmediavictoria.net.au\/?p=36359","title":{"rendered":"E&amp;R Showcases Advanced Packaging Innovations at IEEE ECTC 2025 in Texas"},"content":{"rendered":"<p><span class=\"legendSpanClass\">KAOHSIUNG<\/span>, <span class=\"legendSpanClass\"><span class=\"xn-chron\">May 12, 2025<\/span><\/span> \/PRNewswire\/ &#8212; E&amp;R Engineering Corp. is excited to participate in the&nbsp;<b>75th IEEE Electronic Components and Technology Conference (ECTC)<\/b>, taking place from <b>May 27\u201330, 2025<\/b> at the <b>Gaylord Texan Resort &amp; Convention Center<\/b> in <span class=\"xn-location\">Texas<\/span>.<\/p>\n<p>This year, E&amp;R will highlight its latest solutions in<b> Advanced Packaging,<\/b> including high-precision laser drilling for 2.5D\/3D ICs, multi-beam laser application, and plasma systems with excellent uniformity and thermal stability. E&amp;R will also showcase its comprehensive Flip Chip solution\u2014featuring pre-die bond and pre-underfill plasma cleaning, as well as on-boat\/tray laser marking for high-integrity traceability.<\/p>\n<p>Our <b>Marketing Director <span class=\"xn-person\">Kevin Chang<\/span><\/b> and <b>Sales Supervisor <span class=\"xn-person\">Leo Lee<\/span><\/b>, both with extensive experience in the North American market, will be present to engage with partners and customers.<\/p>\n<p>E&amp;R will be co-exhibiting at the booth of our valued partner <b>Scientech<\/b>. We warmly invite you to visit us and explore how our advanced technologies can help shape the future of semiconductor packaging.<\/p>\n<div class=\"PRN_ImbeddedAssetReference\" id=\"DivAssetPlaceHolder6804\" readability=\"7\">\n<p><a href=\"https:\/\/mma.prnasia.com\/media2\/2684693\/E_R.html\" target=\"_blank\" rel=\"nofollow noopener\"><img decoding=\"async\" src=\"https:\/\/mma.prnasia.com\/media2\/2684693\/E_R.jpg?p=medium600\" title=\"E&amp;R Advanced Packaging Solution.\" alt=\"E&amp;R Advanced Packaging Solution.\"><\/a><br \/><span>E&amp;R Advanced Packaging Solution.<\/span><\/p>\n<\/p><\/div>\n<p><b>Booth Information<\/b><br \/>Booth Number: 438<br \/>Date: May 27\u201330, 2025<br \/>Location: Gaylord Texan Resort &amp; Convention <span class=\"xn-location\">Center, Texas<\/span><br \/>Address:&nbsp; 1501 Gaylord Trail, <span class=\"xn-location\">Grapevine, Texas<\/span>, USA, 76051<br \/>Visit us at Scientech&#8217;s Booth!<\/p>\n<p><b>E&amp;R Website: <\/b><a href=\"https:\/\/en.enr.com.tw\/\" target=\"_blank\" rel=\"nofollow noopener\">https:\/\/en.enr.com.tw\/<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>KAOHSIUNG, May 12, 2025 \/PRNewswire\/ &#8212; E&amp;R Engineering Corp. is excited to participate in the&nbsp;75th IEEE Electronic Components and Technology Conference (ECTC), taking place from May 27\u201330, 2025 at the Gaylord Texan Resort &amp; Convention Center in Texas. This year, E&amp;R will highlight its latest solutions in Advanced Packaging, including high-precision laser drilling for 2.5D\/3D [&hellip;]<\/p>\n","protected":false},"author":8,"featured_media":36360,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[20],"tags":[],"class_list":["post-36359","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-business-news"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>E&amp;R Showcases Advanced Packaging Innovations at IEEE ECTC 2025 in Texas - My Blog<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/transmediavictoria.net.au\/?p=36359\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"E&amp;R Showcases Advanced Packaging Innovations at IEEE ECTC 2025 in Texas - My Blog\" \/>\n<meta property=\"og:description\" content=\"KAOHSIUNG, May 12, 2025 \/PRNewswire\/ &#8212; E&amp;R Engineering Corp. is excited to participate in the&nbsp;75th IEEE Electronic Components and Technology Conference (ECTC), taking place from May 27\u201330, 2025 at the Gaylord Texan Resort &amp; Convention Center in Texas. 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