{"id":39368,"date":"2025-08-27T23:30:00","date_gmt":"2025-08-27T23:30:00","guid":{"rendered":"https:\/\/www.prnasia.com\/story\/archive\/4760126_CN60126_0"},"modified":"2025-08-27T23:30:00","modified_gmt":"2025-08-27T23:30:00","slug":"sk-hynix-starts-supplying-mobile-dram-with-highly-efficient-heat-dissipation","status":"publish","type":"post","link":"https:\/\/transmediavictoria.net.au\/?p=39368","title":{"rendered":"SK hynix Starts Supplying Mobile DRAM with Highly Efficient Heat Dissipation"},"content":{"rendered":"<div id=\"dvContent\" readability=\"80.864539434076\">\n<ul type=\"disc\">\n<li><b>Company first in industry to develop High-K EMC material, improves thermal conductivity by 3.5 times, thermal resistance by 47%<\/b><\/li>\n<li><b>Customers expect achievement to help address heat issue generated from on-device AI<\/b><\/li>\n<li><b>SK hynix to lead next-generation DRAM for mobile device through technological innovation of materials<\/b><\/li>\n<\/ul>\n<p><span class=\"legendSpanClass\"><span class=\"xn-location\">SEOUL, South Korea<\/span>, Aug. 28, 2025 \/PRNewswire\/ &#8212; SK hynix Inc. (or &#8220;the company&#8221;,&nbsp;<a href=\"https:\/\/www.skhynix.com\/eng\/main.do\" target=\"_blank\" rel=\"nofollow noopener\">www.skhynix.com<\/a>) announced today that it has started supplying mobile DRAM products with highly efficient heat dissipation by adopting the High-K Epoxy Molding Compound* material for the first time in the industry.<\/span><\/p>\n<div>\n<table border=\"0\" cellspacing=\"0\" cellpadding=\"1\" class=\"prnbcc\">\n<tbody readability=\"3.5\">\n<tr readability=\"10.5\">\n<td class=\"prngen2\" colspan=\"1\" rowspan=\"1\" readability=\"10\">\n<p class=\"prnml4\"><span class=\"prnews_span\">* EMC(Epoxy Molding Compound): a critical material for semiconductor packaging that protects chips from various external conditions such as water, heat, impact and electronic charge and provides a channel where heat can be dissipated. High-K EMC raises thermal conductivity with adoption of a material with high heat-transfer coefficient in EMC<\/span><\/p>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table><\/div>\n<p>The development comes as heat generated in the process of fast data transfer for on-device AI applications results in performance degradation of smartphones. Global smartphone companies welcome the launch of the product on expectations that it will help address the heat issue of high-performance flagship smartphones.<\/p>\n<p>The structure of package on package, or PoP**, that most flagship smartphones adopt and stacks DRAM onto the application processor***, allows efficient use of limited space, while improving data transfer speed. Such system, however, also triggers a performance degradation of the device itself as heat generated within the mobile AP stays inside DRAM.<\/p>\n<div>\n<table border=\"0\" cellspacing=\"0\" cellpadding=\"1\" class=\"prnbcc\">\n<tbody readability=\"4\">\n<tr readability=\"7.5\">\n<td class=\"prngen2\" colspan=\"1\" rowspan=\"1\" readability=\"8\">\n<p class=\"prnml4\"><span class=\"prnews_span\"><i>** PoP(Package on Package): a packaging method commonly used for mobile products. Different types of chips are stacked vertically to improve space efficiency, performance and flexibility of combinations<\/i><\/span><\/p>\n<\/td>\n<\/tr>\n<tr readability=\"4.5\">\n<td class=\"prngen2\" colspan=\"1\" rowspan=\"1\" readability=\"6\">\n<p class=\"prnml4\"><span class=\"prnews_span\"><i>*** Mobile AP(Application Processor): chip referred to the brain of mobile devices such as smartphones and tablets<\/i><\/span><\/p>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table><\/div>\n<p>SK hynix found the solution in improvement of thermal conductivity of EMC, a critical material that covers DRAM package and developed High-K EMC by adding Alumina to Silica, which has been adopted for EMC material so far.<\/p>\n<p>With thermal conductivity improved by 3.5 times an<span id=\"spanHghlt6514\">d thermal res<\/span>istance in the vertical course of the heat improved by 47%, the new technology is expected to contribute to a longer battery runtime and&nbsp; product lifespan by improving performance of a smartphone and reducing power consumption.<\/p>\n<p>&#8220;It&#8217;s a meaningful achievement that goes beyond a simple performance improvement as it addresse<span id=\"spanHghlteeda\">s the incon<\/span>venience that many high-performance smartphone users may have had,&#8221; Lee Gyujei, Head of Package Product Development, said. &#8220;We are committed to firmly establishing our technological leadership in the next-generation mobile DRAM market with our technological innovation in materials.&#8221;<\/p>\n<p><b>About SK hynix Inc.<\/b><\/p>\n<p>SK hynix Inc., headquartered in Korea, is the world&#8217;s top tier semiconductor supplier offering Dynamic Random Access Memory chips (&#8220;DRAM&#8221;) and flash memory chips (&#8220;NAND&nbsp;flash&#8221;)&nbsp;for a wide range of distinguished customers globally. The Company&#8217;s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at <a href=\"https:\/\/www.skhynix.com\/eng\/main.do\" target=\"_blank\" rel=\"nofollow noopener\">www.skhynix.com<\/a>, <a href=\"https:\/\/news.skhynix.com\/\" target=\"_blank\" rel=\"nofollow noopener\">news.skhynix.com<\/a>.<\/p>\n<\/p><\/div>\n<p>Source: SK hynix Inc.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Company first in industry to develop High-K EMC material, improves thermal conductivity by 3.5 times, thermal resistance by 47% Customers expect achievement to help address heat issue generated from on-device AI SK hynix to lead next-generation DRAM for mobile device through technological innovation of materials SEOUL, South Korea, Aug. 28, 2025 \/PRNewswire\/ &#8212; SK hynix [&hellip;]<\/p>\n","protected":false},"author":8,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[20],"tags":[],"class_list":["post-39368","post","type-post","status-publish","format-standard","hentry","category-business-news"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>SK hynix Starts Supplying Mobile DRAM with Highly Efficient Heat Dissipation - My Blog<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/transmediavictoria.net.au\/?p=39368\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"SK hynix Starts Supplying Mobile DRAM with Highly Efficient Heat Dissipation - My Blog\" \/>\n<meta property=\"og:description\" content=\"Company first in industry to develop High-K EMC material, improves thermal conductivity by 3.5 times, thermal resistance by 47% Customers expect achievement to help address heat issue generated from on-device AI SK hynix to lead next-generation DRAM for mobile device through technological innovation of materials SEOUL, South Korea, Aug. 28, 2025 \/PRNewswire\/ &#8212; 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