{"id":40184,"date":"2025-09-24T17:00:00","date_gmt":"2025-09-24T17:00:00","guid":{"rendered":"https:\/\/www.prnasia.com\/story\/archive\/4780934_HK80934_0"},"modified":"2025-09-24T17:00:00","modified_gmt":"2025-09-24T17:00:00","slug":"tech-forum-2025-asics-packaging-and-hbm-reshape-the-ai-chip-race","status":"publish","type":"post","link":"https:\/\/transmediavictoria.net.au\/?p=40184","title":{"rendered":"Tech Forum 2025: ASICs, packaging, and HBM reshape the AI chip race"},"content":{"rendered":"

TAIPEI<\/span>, Sept. 25, 2025 \/PRNewswire\/ — The global market for high-end cloud AI accelerators is approaching a major turning point. DIGITIMES<\/i> forecasts that beginning in 2026, the supply chain will enter a new “decentralized<\/span>” phase shaped by three forces: the expansion of custom ASICs, diversification of advanced packaging, and intensifying competition in high-bandwidth memory (HBM) pricing.<\/span><\/p>\n

\n

\"Credit: <\/a>
Credit: Digitimes<\/span><\/p>\n<\/p><\/div>\n

ASICs gain ground on GPUs<\/b><\/p>\n

Cloud service providers are accelerating in-house ASIC<\/span> development to gain tighter control over performance and costs. DIGITIMES<\/i> projects that between 2025 and 2029, the compound annual growth rate for high-end cloud ASICs will reach 21%, far outpacing GPUs at 7%.<\/p>\n

Google and Amazon, both leading adopters, are pursuing vertical integration and platform strategies that convert compute resources into cost advantages for customers. Meta and Microsoft, after years of ASIC<\/span> research, are also scaling deployments. While GPUs remain indispensable for training workloads, custom ASICs are steadily eroding their market share.<\/p>\n

Packaging moves beyond TSMC<\/b><\/p>\n

In advanced packaging, the non-TSMC ecosystem is rapidly gaining traction. By the fourth quarter of 2026, non-TSMC suppliers are projected to account for 31% of global CoWoS-class capacity, up from 26% in late 2024.<\/p>\n

ASE, Amkor, and SJSemi are emerging with distinct competitive angles: cost and scale, the US-based manufacturing, and China’s<\/span> domestic demand, respectively. Intel is also pushing its EMIB technology, embedding silicon bridges in substrates to reduce costs and strengthen its “made in America” position. The result is a clear shift: high-end AI chips will no longer depend overwhelmingly on TSMC’s packaging lines.<\/p>\n

Memory costs surge with HBM4<\/b><\/p>\n

On the memory side, cloud accelerators will begin adopting HBM4 in 2026. DIGITIMES<\/i> estimates that average selling prices for HBM4 will be roughly 53% higher than HBM3E, pushing memory’s share of total bill-of-materials costs above 50% for top-tier accelerators. Samsung is betting<\/span> on advanced process technology and aggressive price cuts to win NVIDIA orders, directly challenging SK hynix’s long-standing dominance, while Micron continues steady capacity expansion.<\/p>\n

Three emerging opportunities<\/b><\/p>\n

DIGITIMES<\/i> highlights three major opportunities in this shifting landscape:<\/b><\/p>\n

Custom ASIC<\/span> solutions to give cloud providers stronger cost control.<\/p>\n

Regionalized advanced packaging capacity to meet the US manufacturing and China<\/span> localization demands.<\/p>\n

High cost-efficiency HBM offerings to deliver affordable memory in a period of steep price inflation.<\/p>\n

Overall, the AI accelerator industry is moving away from a centralized supply model toward a more decentralized<\/span>, competitive ecosystem. Only those companies that form strategic alliances and integrate technologies effectively will be able to stay ahead in this new era.<\/p>\n","protected":false},"excerpt":{"rendered":"

TAIPEI, Sept. 25, 2025 \/PRNewswire\/ — The global market for high-end cloud AI accelerators is approaching a major turning point. DIGITIMES forecasts that beginning in 2026, the supply chain will enter a new “decentralized” phase shaped by three forces: the expansion of custom ASICs, diversification of advanced packaging, and intensifying competition in high-bandwidth memory (HBM) pricing. […]<\/p>\n","protected":false},"author":8,"featured_media":40185,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[20],"tags":[],"class_list":["post-40184","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-business-news"],"yoast_head":"\nTech Forum 2025: ASICs, packaging, and HBM reshape the AI chip race - My Blog<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/transmediavictoria.net.au\/?p=40184\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Tech Forum 2025: ASICs, packaging, and HBM reshape the AI chip race - My Blog\" \/>\n<meta property=\"og:description\" content=\"TAIPEI, Sept. 25, 2025 \/PRNewswire\/ — The global market for high-end cloud AI accelerators is approaching a major turning point. 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