{"id":42171,"date":"2025-12-17T18:00:00","date_gmt":"2025-12-17T18:00:00","guid":{"rendered":"https:\/\/www.prnasia.com\/story\/archive\/4845354_HK45354_0"},"modified":"2025-12-17T18:00:00","modified_gmt":"2025-12-17T18:00:00","slug":"ap-memory-broadens-s-sicap-technology-deployment-to-support-evolving-ai-and-hpc-needs","status":"publish","type":"post","link":"https:\/\/transmediavictoria.net.au\/?p=42171","title":{"rendered":"AP Memory Broadens S-SiCap\u2122 Technology Deployment to Support Evolving AI and HPC Needs"},"content":{"rendered":"
\n

HSINCHU<\/span>, Dec. 18, 2025 \/PRNewswire\/ — AP Memory, a leading global design company providing customized memory solutions, today announced further advancements in its S-SiCapTM<\/sup> (Stack Silicon Capacitor) product line to address the increasing integration demands of AI servers and high-performance computing (HPC) systems. The S-SiCapTM<\/sup> portfolio includes two product categories \u2014discrete silicon capacitors and interposers with silicon capacitors \u2014 designed to support different system architectures and diverse application requirements.<\/p>\n

The discrete silicon capacitors, S-SiCapTM<\/sup> Gen4, achieves a capacitance density of 3.8 \u03bcF\/mm\u00b2, an increase of more than 50% over the previous generation. To meet the growing demand for higher performance and power efficiency in AI servers and HPC systems, S-SiCapTM<\/sup> Gen4 is the first to adopt embedded substrate packaging and is currently in the sampling and process validation stage. Mass production will be introduced progressively starting in 2026.<\/p>\n

Meanwhile, the S-SiCapTM<\/sup> Interposer utilizes a silicon wafer as its substrate, embedding high-density silicon capacitors within the interposer. This significantly enhances signal integrity and power stability for high-speed I\/O applications such as die-to-die, SerDes, and HBM. In collaboration with supply-chain partners, AP Memory has introduced a reticle-stitching technology to enlarge interposer die area allowing more IC chiplets to meet the growing demand for higher-integration advanced packaging solutions. The S-SiCapTM<\/sup> Interposer has completed customer packaging and reliability validation, entering four-reticle mass production at the end of Q3’25. Additional development projects are currently underway.<\/p>\n

Ivan Hong<\/span>, President of AP Memory, stated, “As AI and HPC applications continue to evolve rapidly, the industry is facing increasingly stringent requirements for power integrity and high-speed signal transmission. Through the S-SiCapTM<\/sup> product line, AP Memory delivers silicon capacitor technology in both discrete components and interposer-integrated forms, providing high performance, high integration, and design flexibility to meet the demands of next-generation AI and HPC systems.” Looking ahead, AP Memory is actively developing silicon capacitor solutions for organic interposer architectures, further expanding its product portfolio.<\/p>\n

About AP Memory<\/p>\n

AP Memory (TWSE: 6531) is a global fabless design semiconductor company specializing in customized memory design and IP solutions.  Products include IoT memory (IoTRAMTM<\/sup>), AI memory solutions (VHMTM<\/sup>), and silicon capacitors (S-SiCapTM<\/sup>). With strong R&D capabilities, AP Memory is committed to providing high performance, low-power and innovative customized products and solutions for applications such as mobile communication, wearable, IoT, high-end mobile application, high-performance computing, and edge computing.<\/p>\n

For more information, please visit www.apmemory.com<\/a>.<\/p>\n<\/p><\/div>\n

Source: AP Memory Technology Corp.<\/p>\n","protected":false},"excerpt":{"rendered":"

HSINCHU, Dec. 18, 2025 \/PRNewswire\/ — AP Memory, a leading global design company providing customized memory solutions, today announced further advancements in its S-SiCapTM (Stack Silicon Capacitor) product line to address the increasing integration demands of AI servers and high-performance computing (HPC) systems. 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