{"id":45541,"date":"2026-07-07T14:00:00","date_gmt":"2026-07-07T14:00:00","guid":{"rendered":"http:\/\/www.prnasia.com\/story\/archive\/4998653_AE98653_0"},"modified":"2026-07-07T14:00:00","modified_gmt":"2026-07-07T14:00:00","slug":"semi-and-techsearch-international-release-2026-edition-of-worldwide-assembly-test-facility-database","status":"publish","type":"post","link":"https:\/\/transmediavictoria.net.au\/?p=45541","title":{"rendered":"SEMI and TechSearch International Release 2026 Edition of Worldwide Assembly & Test Facility Database"},"content":{"rendered":"\n\n\n
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Expanded Coverage and New Data Fields Provide Greater Visibility into Compound Semiconductor, AI\/HPC and Photonics Activity<\/i><\/p>\n

MILPITAS, Calif.<\/span>, July 7, 2026<\/span> \/PRNewswire\/ — SEMI and TechSearch International today announced the release of the 2026 edition of the Worldwide Assembly & Test Facility Database<\/a>, a comprehensive resource tracking semiconductor back-end manufacturing facilities operated by integrated device manufacturers (IDMs) and outsourced semiconductor assembly and test (OSAT) companies worldwide.<\/p>\n

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\"SEMI\u00ae<\/a>
SEMI\u00ae is the global industry association connecting over 4,000 companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON\u00ae expositions and events, technology communities, standards and market intelligence help advance our members\u2019 business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org to learn more.<\/span><\/p>\n<\/p><\/div>\n

The 2026 edition covers more than 820 facilities, up from 750 in the 2025 edition, and adds new fields that help users analyze not only where facilities are located and what assembly and test services they provide, but also the materials, platforms, technologies and end markets they support.<\/p>\n

Based on the new classifications, more than 360 facilities report compound semiconductor capabilities, including sites supporting silicon carbide (SiC), gallium nitride (GaN), gallium arsenide (GaAs) and indium phosphide (InP). More than 170 facilities identify AI and high-performance computing (HPC) among their end-market focus, while more than 70 facilities support photonics and optical applications. The new fields also capture substrate and interposer platforms along with broader technology and module capabilities, providing clearer visibility into how global back-end infrastructure is aligning with emerging demand.<\/p>\n

“AI infrastructure, photonics and compound semiconductors are expanding the range of capabilities required across semiconductor assembly and test,” said Clark Tseng, Senior Director of Market Intelligence at SEMI. “The 2026 database gives users a more detailed view of which facilities support these technologies and end markets, helping them assess supply-chain exposure, identify manufacturing partners and track the evolution of global back-end capabilities.”<\/p>\n

The 2026 edition includes the following updates and enhancements:<\/b><\/p>\n